Over the past decade, we have been dedicated to delivering high-quality PCB design and one-stop electronic engineering services, and earned customer trust through competitive pricing and superior service. We are capable of fulfilling all design demands from product conception to mass production regardless of project scale. Our comprehensive PCB design capability ensures full compliance with your technical requirements and DFM (Design for Manufacturability) criteria, eliminating unnecessary repeated design iterations. It effectively helps clients accelerate the process from product design to market promotion.

We are competent in the following PCB design work ：
High-speed multilayer digital PCB design, high-frequency RF/microwave PCB design, low-level analog PCB design, ultra-low EMI design for magnetic resonance imaging, DDR2, DDR3, DDR4 memory design, printed antenna design, complete assembly drawings, circuit test data generation, component selection and placement data generation, drilling, panelization & V-Cut, professional manufacturing documents, automatic routing for high-density PCB design。

We have experience in the following industries：
Automotive Electronics, Digital Electronics, Security Monitoring, Communication Networks, Medical Devices, Industrial Fuel Delivery Systems, Industrial Process Control, Visual Virtual Simulation Systems, Aviation Control Equipment, Scientific Multi-processor System Research, Asynchronous Transmission Hardware, High Reliability Computer Hardware, Video & Teleconferencing, Network Hardware, RF Transmission, Bluetooth Modules。
Our PCB designs conform to the IPC 2200 series standards. All design solutions can be manufactured per IPC 6011 and IPC 6012 standards and assembled in line with IPC-A-610 standards. We will finish relevant PCB design tasks accurately and timely according to your schedule, guarantee smooth mass production via high-quality design and prevent rework.。

Digital, high-speed and analog design capabilities include：
Circuit design and analysis, FPGA to ASIC conversion, component analysis and evaluation, compliance and value engineering, pulse circuits, analog circuit simulation; Embedded microprocessors and chipsets for Power PC, Intel x86, TI DSP, Mellanox and Broadcom, as well as various other chipsets used in server, telecommunications, industrial and commercial sectors.。

Our mechanical engineering capabilities include：
Packaging, enclosure & industrial design, product/system architecture, detailed mechanical design, FEA stress analysis, shock & vibration simulation, thermal simulation, material and component selection, solid modeling, PCB-coordinated DFM/DFA design and cost reduction。